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Showing posts with the label High Density Interconnect PCB Industry

High Density Interconnect PCB Market Growth, Statistics, Competitor Landscape, Key Players Analysis, Trends and Forecast by 2027 | Impact of COVID-19

  Market Overview:  Market Research Future (MRFR), in its latest report on the Globally, the HDI PCB Market 2020, states major factors that are expected to boost the expansion of the market across the study period. An in-depth analysis of the impact of coronavirus outbreak on the High Density Interconnect PCB Market is provided along with the report. As per MRFR analysis, the worldwide market of  High Density Interconnect PCB  is expected to rise at 12.4% CAGR across the analysis period 2018–2013. High Density Interconnect PCB value can touch USD 15,600.6 Mn from USD 8,683.9 Mn in 2018 to 2023. The growing awareness about the higher circuitry density of HDI PCB over traditional PCB that allows designers to fit more components on an HDI PCB is expected to underpin the expansion of the market in the years to come. Features, such as shorter distance between electronic components and their compactness aid in the reduction of signal loss and crossing delays that result in the rapid transmis